Methods of operating electronic devices, and methods of providing electronic devices

ABSTRACT

Some embodiments include a method disposing an integrated circuit die within a housing, the integrated circuit die having integrated circuitry formed thereon, the integrated circuitry including first transponder circuitry configured to transmit and receive radio frequency signals, wherein the integrated circuit die is void of external electrical connections for anything except power supply external connections; and disposing second transponder circuitry, discrete from the first transponder circuitry, within the housing, the second transponder circuitry being configured to transmit and receive radio frequency signals, wherein the first and second transponder circuitry are configured to establish wireless communication between one another within the housing, the second transponder circuitry being disposed within 24 inches of the first transponder circuitry within the housing.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation application of U.S. patentapplication Ser. No. 11/847,645 filed on Aug. 30, 2007 which is about toissue as U.S. Pat. No. 7,778,621 on Aug. 17, 2010, which is acontinuation application of U.S. patent application Ser. No. 11/512,783filed on Aug. 29, 2006 and issued as U.S. Pat. No. 7,593,708 on Sep. 22,2009, which is a continuation of U.S. patent application Ser. No.10/793,173 filed on Mar. 3, 2004 and issued as U.S. Pat. No. 7,107,019on Sep. 12, 2006, which is a continuation of U.S. patent applicationSer. No. 10/371,123 filed on Feb. 19, 2003 which issued as U.S. Pat. No.6,718,163 on Apr. 6, 2004, which is a continuation of U.S. patentapplication Ser. No. 09/260,997 filed on Mar. 1, 1999 which issued asU.S. Pat. No. 6,542,520 on Apr. 1, 2003, the disclosures of which areincorporated by reference herein.

TECHNICAL FIELD

The technical field is electronic devices, methods of operatingelectronic devices, and methods of forming electronic devices.

BACKGROUND OF THE INVENTION

As semiconductor integrated circuit (IC) devices continue to shrink indimension, challenges are posed with respect to packaging the integratedcircuitry into microelectronic devices. In some prior art integratedcircuitry device, individual IC chips (die) are connected to inner leadsof a lead frame by wire bonds. The chip, wire bonds, and inner leads arecompletely encapsulated for protection with a substance such as plasticor ceramic. Outer leads communicate with the inner leads of the leadframe, but the outer leads typically remain exposed for mounting of thepackaged device to external circuitry, such as a printed circuit board.Exemplary constructions are disclosed in U.S. Pat. Nos. 5,734,198,5,736,783, 5,763,945, 5,818,105 5,117,068, and 5,692,298, thedisclosures of which are incorporated by reference herein.

In a conventional construction, a semiconductor die is placed on andbonded to a center die paddle of a lead frame for support. Inner leadfingers of the lead frame are disposed proximate the paddle but do notcontact or communicate with the paddle. Rather, wire bonds communicatebetween contact pads (terminals) on the die and the inner lead fingersof the lead frame by spanning a gap between the die and the fingers. Thewire bonds allow for the transmission of electrical signals between thedie and the lead frame. The lead fingers allow the chip or die to beelectrically connected with other chips or die for providing an operablemicroelectronic device.

Wire bonds can be problematic for a number of different reasons. First,additional processing steps are needed to ensure that the wire bonds areadequately formed between the lead frame and bond pads on the integratedcircuit die. Such processing requires precise placement of the wirebonds or the operation of the integrated circuit die can be compromised.Additionally, because wire bonds are typically very thin electricalconnections they can become disconnected and cause operational failureof the finished device.

Accordingly, this invention arose out of concerns associated withproviding improved microelectronic devices and methods of forming thesame which reduce processing complexities and provide for improvedperformance.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a side elevational view of a microelectronic device inaccordance with one embodiment of the invention, with a portion havingbeen broken away for clarity.

FIG. 2 is a top plan view of a portion of a microelectronic device inaccordance with one embodiment of the invention.

FIG. 3 is a top plan view of a portion of a microelectronic device inaccordance with one embodiment of the invention.

FIG. 4 is a high level block diagram of an integrated circuit die inaccordance with one embodiment of the invention.

FIG. 5 is a high level block diagram of a microelectronic device inaccordance with one embodiment of the invention.

FIG. 6 is a flow diagram which describes one embodiment of the presentinvention.

FIG. 7 is a flow diagram which describes one embodiment of the presentinvention.

FIG. 8 is a flow diagram which describes one embodiment of the presentinvention.

FIG. 9 is a side elevational view of a microelectronic device inaccordance with one embodiment of the invention.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

Referring to FIGS. 1-5, and particularly to FIG. 1, an exemplarymicroelectronic device in accordance with one embodiment of theinvention is shown generally at 10. The term “microelectronic device” asused in this document will be understood to include, without limitation,integrated circuit devices which are resident on a single die or chip,or a collection of die or chips arranged into an operable integratedcircuit configuration. Device 10 includes a microelectronic package 12which provides a housing within which integrated circuitry is received.The term “microelectronic package” will be understood to mean a housingor container within which integrated circuitry is received to provide amicroelectronic device. By way of example only, example microelectronicpackages include product containers such as computer hard drivehousings, cellular phone housings, and other hand-held electronic devicehousings. Such microelectronic packages need not, however, be hand-held.In addition, microelectronic packages can include self-containedhermetically-sealed packages such as those which conventionally containintegrated circuit die. Such packages can be formed from plastic,ceramic, or any other suitable material.

In FIG. 1, a portion of package 12 has been broken away for clarity. Anintegrated circuit die 14 is received within microelectronic package 12and has integrated circuitry formed thereon. In this example, package 12includes individual die 16, 18, 20, and 22 which have been prepackagedinto individual respective integrated circuit chips which containintegrated circuitry which can be or is electrically connected into anoperative arrangement.

In FIG. 2, a top plan view of die 14, 16 is shown. The dashed lineswhich bound the individual die are intended to represent the exterior ofa die or chip container. In a preferred embodiment, one of theintegrated circuit die, e.g. die 14, includes integrated circuitry 24(FIG. 4) having first transmit/receive circuitry 26 configured totransmit and receive radio frequency signals. Second transmit/receivecircuitry (such as circuitry 26) is provided which is preferablydiscrete from first transmit/receive circuitry 26. Such secondtransmit/receive circuitry can be received or supported by die 16.Accordingly, the second transmit/receive circuitry is contained withinmicroelectronic package 12 and is configured to transmit and receiveradio frequency signals.

In a preferred embodiment, the first and second transmit/receivecircuitry 26 are configured to establish wireless communication betweenone another within the microelectronic package. In one embodiment,second transmit/receive circuitry (such as circuitry 26 b in FIG. 5) isdisposed on a second integrated circuit die such as die 14 b. In anotherembodiment, the microelectronic device further includes a substrate 30(FIGS. 1 and 2) disposed within the housing and supporting the first andsecond transmit/receive circuitry 26. Any suitable material can be usedfor substrate with exemplary substrates including a printed circuitboard.

In one embodiment, microelectronic devices can be provided which aresmall in size, such as those which can be hand-carried or transported.In another embodiment, the integrated circuitry comprising the first andsecond transmit/receive circuitry 26 are disposed within 24 inches ofone another (distance d in FIG. 2) within the microelectronic package.In another embodiment (FIGS. 3-5), integrated circuitry 24 comprisingthe first and second transmit/receive circuitry 26 respectively,comprise individual respective antennas 32 (FIG. 5) which are configuredto transmit and receive wireless communication. The antennas can beconnected to their respective integrated circuitry 24 by a conductivetrace of material (indicated as a dashed line extending betweenintegrated circuitry 24 and antenna 32 in FIG. 3) over the die. Furtheraugmentation can be provided by connecting the antenna to a lead finger,similar to lead fingers 34, 36 (FIG. 3) via a wire bond. In a preferredembodiment, the antennas are configured to transmit and receive wirelessRF communication.

In one embodiment, antennas 32 (FIG. 5) are disposed within 24 inches ofone another within the microelectronic package. In another embodiment,the antennas are disposed within one inch of one another within themicroelectronic package. In yet another embodiment, the antennas aredisposed within one-half inch of one another within the microelectronicpackage.

In one embodiment, and one perhaps best shown in FIG. 3, die 14 is voidof external electrical connections for anything other than at least oneof power and ground. In the illustrated example, lead fingers 34, 36 areprovided and are coupled electrically with die 14 via wire bonds 38, 40respectively. The wire bonds connect with contact pads 42, 44respectively on die 14 and provide the connections through which powerand ground are established. These connections, in this example,constitute the only connections which are necessarily made through leadfingers to the outside world. Of course, other connections can be madethrough lead fingers which are not specifically illustrated.

Referring still to FIGS. 1-5, and in accordance with another embodiment,an integrated circuit die 14 is received within microelectronic package12 and has integrated circuitry thereon which is configured to operatein a designed manner. By “designed manner” is meant any manner in whichintegrated circuitry is conventionally able to operate. In this example,integrated circuitry 24 includes a processor 46 (FIG. 4), 46 a, 46 b(FIG. 5). Processor 46 can comprise any suitably formed or providedprocessor, e.g. a microprocessor, which is conventionally employed inintegrated circuitry devices. FIG. 4 also shows integrated circuitry 24as including a receiver/transmitter 26. Although this element is shownas a combination receiver/transmitter, it can comprise only a receiveror only a transmitter.

FIG. 5 shows an exemplary device which comprises two die 14 a, 14 b.These die are preferably part of and received inside of microelectronicpackage 12. An integrated circuitry transmitter 26 a is provided andreceived within microelectronic package 12. The transmitter can, butneed not have a companion receiver. The transmitter is preferablyconfigured to transmit wireless communication. An integrated circuitryreceiver 26 b is provided and is received within microelectronic package12. The receiver can, but need not have a companion transmitter.Receiver 26 b is preferably configured to receive wireless communicationwhich is transmitted by integrated circuitry transmitter 26 a. In apreferred embodiment, receiver 26 b is operably coupled with a processor46 b and configured to provide data to the processor responsive toreceived wireless communication. In one embodiment, receiver 26 bcomprises a portion of the integrated circuitry which is formed on die14 b. In another embodiment, integrated circuitry transmitter 26 a isdisposed on a second integrated circuit die. In another embodiment, morethan one die is received within the housing, as shown best in FIG. 1.The plurality of die all may or may not be configured to communicatewith one another.

Preferably, die 14 a, 14 b are configured in some applications toestablish wireless communication between them in a manner which servesto eliminate most, if not all physical-electrical connections which wereformerly employed to establish wireless communication therebetween. Forexample, and as prevalent in the prior art, individual die wereconnected, via suitable wire bonds, to lead frames which, in turn,established electrical communication with the outside world. Inaccordance with some of the inventive structures and methods, many ofthe wire bonds and lead fingers on the lead frames can be eliminatedbecause now, functional communication between the separate die takesplace through the transmission of wireless communication. Of course, insome embodiments, physical-electrical connection can be provided inorder to supply desired die with suitable power and ground connections.

In one embodiment, the transmitter and the receiver are disposed withinthe microelectronic package within 24 inches of one another. In anotherembodiment, the transmitter and the receiver are disposed within themicroelectronic package within one inch of one another. In anotherembodiment, the transmitter and receiver are disposed within themicroelectronic package within one-half inch of one another.

Preferably, processor 46 is configured to receive data which is providedby receiver 26 and, responsive thereto, cause the integrated circuitryon die 14 to operate in the above-mentioned designed manner. In apreferred embodiment, the microelectronic device 10 ishand-transportable.

Referring still to FIGS. 1-5, and in accordance with another embodimentof the invention, a microelectronic device includes a microelectronicpackage 12 which provides a housing within which integrated circuitry isreceived. The microelectronic package preferably includes an integratedcircuitry-supporting substrate 30 inside the housing. An integratedcircuit die, e.g. any and/or all of die 14-22, is received withinpackage 12 and supported by substrate 30. The die preferably hasintegrated circuitry formed thereon comprising first transmit/receivecircuitry 26 a (FIG. 5) configured to transmit and receive wirelesscommunication. Second transmit/receive circuitry 26 b is provided and ispreferably discrete from first transmit/receive circuitry 26 a. Thesecond transmit/receive circuitry 26 b is preferably contained withinmicroelectronic package 12 and is configured to transmit and receivewireless communication. In this example, the first and secondtransmit/receive circuitry 26 a, 26 b are configured to establishwireless communication between one another within the microelectronicpackage 12 sufficient to enable the integrated circuitry on die 14 tooperate in a designed manner. In one embodiment, the secondtransmit/receive circuitry is supported by the integratedcircuit-supporting substrate 30. In another embodiment, the secondtransmit/receive circuitry 26 b is disposed on a second integratedcircuit die supported by the integrated circuitry-supporting substrate30. In another embodiment, device 10 is hand-transportable.

In another embodiment, individual antennas 32 (FIG. 5) are provided andare operably associated with the first and second transmit/receivecircuitry 26 a, 26 b respectively. In one embodiment, the antennas aredisposed within 24 inches of one another.

In another embodiment, the antennas are disposed within one inch of oneanother. In yet another embodiment, the antennas are disposed withinone-half inch of one another.

Referring to FIG. 6, and in accordance with another embodiment of theinvention, a method of operating a microelectronic device is showngenerally at 100 and includes at 102, providing a microelectronicpackage having housed therein integrated circuitry. At 104, wirelesscommunication is produced using a transmitter inside of themicroelectronic package. At 106, the produced wireless communication isreceived using a receiver inside the microelectronic package. At 108,and responsive to the receiving of the wireless communication, theintegrated circuitry within the microelectronic package is caused tooperate in a designed manner. In one embodiment, the production ofwireless communication at 104 takes place through the use of anintegrated circuitry transmitter. In another embodiment, the receipt ofsuch wireless communication takes place through the use of an integratedcircuitry receiver. Other embodiments further comprise positioning thetransmitter and the receiver inside the microelectronic package within24 inches, one inch, and one-half inch respectively, of one another. Inyet another embodiment, provision of the integrated circuitry within themicroelectronic package comprises fabricating the circuitry.

Referring to FIG. 7, and in accordance with another embodiment of theinvention, a method of operating a microelectronic device is showngenerally at 200 and includes, at 202, providing a microelectronicpackage having housed therein integrated circuitry. At 204, a wirelesscommunication signal is transmitted using an integrated circuitrytransmitter inside the microelectronic package. At 206, the transmittedwireless communication signal is received using an integrated circuitryreceiver inside the microelectronic package. At 208, and responsive toreceiving the wireless communication signal, the integrated circuitrywithin the microelectronic package is caused to operate in a designedmanner. In one embodiment, the transmitter and the receiver arepositioned within 24 inches of one another. In other embodiments, thetransmitter and the receiver are positioned within one inch and one-halfinch respectively, of one another. Further aspects of the inventioninclude fabricating one of the integrated circuitry transmitter orreceiver, or preferably both.

Referring to FIG. 8, and in accordance with another embodiment of theinvention, a method of providing a microelectronic device is showngenerally at 300 and includes at 302 providing a microelectronic packagewithin which integrated circuitry is to be housed. At 304, an integratedcircuitry transmitter is mounted within the package. At 306, anintegrated circuit die is mounted within the package and includesintegrated circuitry disposed thereon. The integrated circuitrypreferably includes an integrated circuit receiver, wherein thetransmitter and the receiver are configured to establish direct wirelesscommunication with one another. Preferably, the wireless communicationpermits operating instructions for the integrated circuitry on the dieto be transmitted and received within the microelectronic package.

In one embodiment, the transmitter and the receiver are mounted within24 inches of one another. In another embodiment the transmitter and thereceiver are mounted within one inch of one another. In yet anotherembodiment, the transmitter and the receiver are mounted within one-halfinch of one another.

Referring to FIG. 9, an exemplary microelectronic device is showngenerally at 50 and includes a microelectronic package 52. Package 52contains and supports an integrated circuit die 54. Physical-electricalconnection structure is provided and shown generally at 56, and securesdie 54 to an integrated circuitry-supporting substrate 58. Thephysical-electrical connection structure provides both electrical andphysical connections between circuit die 54 and outside world circuitry.In this embodiment, physical-electrical connection structure 56 supplieselectrical connections only for power and ground. In this specificexample, the physical-electrical connection structure includesrespective wire bonds 60, 62 which are individually and respectivelyconnected with lead fingers 64, 66.

Advantages of various embodiments of the invention include a reductionin the number wire bonds necessary to impart functionality to amicroelectronic device. Relatedly, the number of processing steps whichare needed to ensure that wire bonds are adequately formed between alead frame and bond pads on an integrated circuit die can be reduced.Hence, risks which were formerly associated with wire bonds becomingdetached because of the very thin nature of such connections can bereduced. Various embodiments of the invention can provide improvedmicroelectronic devices and methods of forming the same which reduceprocessing complexities and provide for improved performance.

In compliance with the statute, the subject matter disclosed herein hasbeen described in language more or less specific as to structural andmethodical features. It is to be understood, however, that the claimsare not limited to the specific features shown and described, since themeans herein disclosed comprise example embodiments. The claims are thusto be afforded full scope as literally worded, and to be appropriatelyinterpreted in accordance with the doctrine of equivalents.

1. A microelectronic package comprising: a first die mounted on asubstrate, the first die having first transmit and receive circuitryconfigured to transmit and receive radio frequency signals via a firstantenna; a second die mounted on the substrate, the second die discretefrom the first die and having second transmit and receive circuitryconfigured to transmit and receive radio frequency signals via a secondantenna; wherein the first die, the second die, and the substrate areall contained within the microelectronic package, at least one of thefirst die and the second die void of electrical interconnects that carrycommunication signals between each other; and wherein the first transmitand receive circuitry and the second transmit and receive circuitry areconfigured to establish a wireless communications link between the firstand second die, and wherein there is no communication between the firstand second die other than via a wireless communications link.
 2. Themicroelectronic package of claim 1, further comprising: a firstprocessor formed on the first die, the first processor coupled to thefirst transmit and receive circuitry wherein the first transmit andreceive circuitry provides data received via the wireless communicationlink to the first processor.
 3. The microelectronic package of claim 2,further comprising: a second processor formed on the second die, thesecond processor coupled to the second transmit and receive circuitrywherein the second transmit and receive circuitry provides data receivedvia the wireless communication link to the second processor.
 4. Themicroelectronic package of claim 1, wherein electronic connectionsbetween the first and second die and the substrate are power connectionsonly.
 5. The microelectronic package of claim 1, wherein the first dieis mounted on the substrate within twenty-four inches of the second die.6. The microelectronic package of claim 1, wherein the first die ismounted on the substrate within one inch of the second die.
 7. Themicroelectronic package of claim 1, wherein the first die is mounted onthe substrate within one-half inch of the second die.
 8. Themicroelectronic package of claim 1, wherein the microelectronic packageis hand-transportable.
 9. A microelectronic device, comprising: amicroelectronic package; and a plurality of die mounted on a substratewithin the microelectronic package, each of the plurality of die havinga processor and transceiver circuitry coupled to the processor, whereinan antenna is coupled to the transceiver circuitry, physical connectionsto each of the plurality of die, wherein the physical connectionsprovide only power connections to the die; wherein the transceivercircuitry on each of the die is configured to establish wirelesscommunications links among individual ones of the die, and wherein thereis no communication among the plurality of die other than via thewireless communications links,
 10. The microelectronic device of claim9, wherein the transceiver circuitry on one or more of the plurality ofdie is configured to either transmit or receive radio frequency signalsvia the antenna.
 11. The microelectronic device of claim 9, wherein thetransceiver circuitry on one or more of the plurality of die isconfigured to both transmit and receive radio frequency signals via theantenna.
 12. The microelectronic device of claim 9, wherein theprocessor is configured to receive data provided by the transceivercircuitry, and wherein the processor operates in a designed manner inresponse to the data provided by the transceiver circuitry.
 13. Themicroelectronic device of claim 9, further comprising physicalconnections to each of the plurality of die, wherein the physicalconnections provide only power and ground connections to the die. 14.The microelectronic device of claim 9, wherein the wirelesscommunications links permit operating instructions for at least one ofthe processors to be transmitted and received.